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李卓霖

时间:2018/7/2 14:15:21    阅读数:48

   

李卓霖

   

民族

出生年月

1984.05

工作时间

2014.09

技术职务

讲师

最后学历

研究生

最后学位

博士

毕业院校

哈尔滨工业大学

导师类别

硕士生导师

联系电话

15098126187

工作单位

材料学院

电子邮箱

Lizl@hit.edu.cn

学术兼职

学习简历

200309月—200706     吉林大学  材料加工专业  本科

200709月—200906     哈尔滨工业大学(深圳) 电子封装专业  硕士

200909月—201406     哈尔滨工业大学(深圳) 电子封装专业  博士

工作简历

201409月—至今  哈尔滨工业大学(威海)

研究领域

1.电子封装技术;2.异质材料超声表面改性及互连;3.电子器件可靠性

科研项目

1. 基于高温功率芯片耐热互连的超声助TLP连接机理研究(山东省自然科学基金青年基金基金,编号: ZR2016EEQ12

2. 面向高温功率器件封装互连的超声TLP连接工艺及机理研究(哈工大科技创新基金,编号:HIT. NSRIF. 2016091

发表论文

1. Z.L. Li, H.J. Dong, X.G. Song, H.Y. Zhao, H. Tian, J.H. Liu, J.C. Feng, J.C. Yan, Homogeneous (Cu, Ni)6Sn5 intermetallic compound joints rapidly formed in asymmetrical Ni/Sn/Cu system using ultrasound-induced transient liquid phase soldering process, Ultrason Sonochem 42 (2018) 403-410.

2. Z.L. Li, H.J. Dong, X.G. Song, H.Y. Zhao, J.C. Feng, J.H. Liu, H. Tian, S.J. Wang, Rapid formation of Ni3Sn4 joints for die attachment of SiC-based high temperature power devices using ultrasound-induced transient liquid phase bonding process, Ultrason Sonochem 36 (2017) 420-426.

3. Z. Li, M. Li, Y. Xiao, C. Wang, Ultrarapid formation of homogeneous Cu6Sn5 and Cu3Sn intermetallic compound joints at room temperature using ultrasonic waves, Ultrason Sonochem 21(3) (2014) 924-9.

4. H.J. Dong, Z.L. Li通讯作者), X.G. Song, H.Y. Zhao, J.C. Yan, H. Tian, J.H. Liu, Grain morphology and mechanical strength of high-melting-temperature intermetallic joints formed in asymmetrical Ni/Sn/Cu system using transient liquid phase soldering process, Journal of Alloys and Compounds 723 (2017) 1026-1031.

5. H.J. Dong, Z.L. Li(通讯作者), X.G. Song, H.Y. Zhao, H. Tian, J.H. Liu, J.C. Yan, Grain morphology evolution and mechanical strength change of intermetallic joints formed in Ni/Sn/Cu system with variety of transient liquid phase soldering temperatures, Materials Science and Engineering: A 705 (2017) 360-365.

6. J. Liu, H. Zhao, Z.L. Li(通讯作者), X. Song, Y. Zhao, H. Niu, H. Tian, H. Dong, J. Feng, Microstructure evolution, grain morphology variation and mechanical property change of Cu-Sn intermetallic joints subjected to high-temperature aging, Materials Characterization 135 (2018) 238-244.

7. J.H. Liu, H.Y. Zhao, Z.L. Li(通讯作者), X.G. Song, H.J. Dong, Y.X. Zhao, J.C. Feng, Study on the microstructure and mechanical properties of Cu-Sn intermetallic joints rapidly formed by ultrasonic-assisted transient liquid phase soldering, Journal of Alloys and Compounds 692 (2017) 552-557.

8. H.Y. Zhao, J.H. Liu, Z.L. Li(通讯作者), Y.X. Zhao, H.W. Niu, X.G. Song, H.J. Dong, Non-interfacial growth of Cu 3 Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process, Materials Letters 186 (2017) 283-288.

9. M. Li, Z.L. Li, Y. Xiao, C. Wang, Rapid formation of Cu/Cu3Sn/Cu joints using ultrasonic bonding process at ambient temperature, Applied Physics Letters 102(9) (2013) 094104.

10. H.Y. Zhao, J.H. Liu, Z.L. Li(通讯作者), X.G. Song, Y.X. Zhao, H.W. Niu, H. Tian, H.J. Dong, J.C. Feng, A Comparative Study on the Microstructure and Mechanical Properties of Cu6Sn5 and Cu3Sn Joints Formed by TLP Soldering With/Without the Assistance of Ultrasonic Waves, Metallurgical and Materials Transactions A 49(7) (2018) 2739-2749.

11. 刘积厚, 赵洪运, 李卓霖,. Cu/Sn/Cu超声-TLP接头的显微组织与力学性能[J]. 金属学报, 2017(2):227-232.